Integrated circuit (IC) device production goes through different stages. Semiconductor testing comes in the third stage of the production. You can find an automated test equipment systems company for ATE integrated circuit for efficient testing. Automated test equipment is used to get efficient test results for devices such as:

  • Wireless
  • Digital/mixed signal
  • Power
  • Linear
  • Memory 
  • Automotive

Every semiconductor device manufacturer wants to ensure that customers get the best quality, dependable devices. For example, an ATE comparator helps compare two voltages or currents quickly and effectively. This is where an automated test equipment systems company helps semiconductor manufacturers.

The word semiconductor is a combination of two words – semi and conductor. The word ‘semi’ comes from Latin. ‘Semi’ means ‘half’. A conductor is a material or object that allows electrical charge carriers to move from one atom to another with the application of voltage. On the other hand, an insulator is a material or object that does not allow the flow of electric charge. A semiconductor is a material or device that falls between an insulator and conductor. Silicon is the most popular material used for making semiconductor devices. One can use a semiconductor as a conductor or insulator. Depending on the temperature and other factors, silicon changes its conducting characteristics. 

When it comes to making an integrated circuit (IC), the journey of silicon begins as a wafer. This is the reason why people working in the industry also use the term ‘sand to wafer’.  

Semiconductor device production has three stages. These stages include:

  • Device research and design
  • Front-end fabrication 
  • Assembly, Test and Packaging 

Design for Manufacturability 

The principles of DFM ensure that the following are incorporated in the design of the device: 

  • Reliability 
  • Quality 
  • Cost effective Measures 
  • Time to market 

Design for Manufacturing helps in improving yield by providing a set of methodologies. When the design is in the final production stage, designers consult with experts to maximize yield. 

Front-End Fabrication 

Integrated circuit manufacturing process or fabrication process is called front-end fabrication. The process begins with deposition. An insulating layer is applied to the incoming silicon water in a pattern. A pattern mask is applied when the wafer moves onto lithography. Now the wafer is etched to create 3D features by selectively removing material. In the next step, the photoresist mask is stripped. After that, the wafer is cleaned to remove particles and residues. This is followed by the deposition of conducting materials. 

Wafer Test 

After wafer fabrication, the next step is the wafer test. Special tests are applied to find functional defects in each individual IC on the wafer. This is performed before a wafer goes for die preparation.    

Package Test 

Package testing is done when the device is in the assembly and testing stage. Diced chips are packaged. It is important to ensure that no chip is damaged during packaging. This is the reason why package tests are important. 

 Testing is extremely important in all industries. Depending on the application of the device, a faulty device can be very harmful. When it comes to semiconductor testing, it is important to find the best automated test equipment systems company.